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 ACTS245T
Data Sheet July 1999 File Number
4611.1
Radiation Hardened Octal Non-Inverting Bidirectional Bus Transceiver
Intersil's Satellite Applications FlowTM (SAF) devices are fully tested and guaranteed to 100kRAD Total Dose. These QML Class T devices are processed to a standard flow intended to meet the cost and shorter lead-time needs of large volume satellite manufacturers, while maintaining a high level of reliability. The Intersil ACTS245T is a Radiation Hardened Octal NonInverting Bidirectional Bus Transceiver intended for two-way asynchronous communication between data busses.
Features
* QML Class T, Per MIL-PRF-38535 * Radiation Performance - Gamma Dose () 1 x 105 RAD(Si) - Latch-Up Free Under Any Conditions - Single Event Upset (SEU) Immunity: <1 x 10-10 Errors/Bit/Day (Typ) - SEU LET Threshold . . . . . . . . . . . . .>100 MEV-cm2/mg * 1.25 Micron Radiation Hardened SOS CMOS * Significant Power Reduction Compared to ALSTTL Logic * DC Operating Voltage Range . . . . . . . . . . . . 4.5V to 5.5V * Input Logic Levels - VIL = 0.8V Max - VIH = VCC/2 Min * Fast Propagation Delay . . . . . . . . 18ns (Max), 12ns (Typ)
Specifications
Specifications for Rad Hard QML devices are controlled by the Defense Supply Center in Columbus (DSCC). The SMD numbers listed below must be used when ordering. Detailed Electrical Specifications for the ACTS245T are contained in SMD 5962-96719. A "hot-link" is provided from our website for downloading. www.intersil.com/spacedefense/newsafclasst.asp Intersil's Quality Management Plan (QM Plan), listing all Class T screening operations, is also available on our website. www.intersil.com/quality/manuals.asp
Pinouts
ACTS245T (SBDIP), CDIP2-T20 TOP VIEW
DIR A0 A1 A2 1 2 3 4 5 6 7 8 9 20 VCC 19 OE 18 B0 17 B1 16 B2 15 B3 14 B4 13 B5 12 B6 11 B7
Ordering Information
ORDERING NUMBER 5962R9671901TRC 5962R9671901TXC PART NUMBER ACTS245DTR ACTS245KTR TEMP. RANGE (oC) -55 to 125 -55 to 125
A3 A4 A5 A6 A7
GND 10
NOTE: Minimum order quantity for -T is 150 units through distribution, or 450 units direct.
ACTS245T (FLATPACK), CDFP4-F20 TOP VIEW
DIR A0 A1 A2 A3 A4 A5 A6 A7 GND 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 VCC OE B0 B1 B2 B3 B4 B5 B6 B7
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CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. www.intersil.com or 407-727-9207 | Copyright (c) Intersil Corporation 1999
ACTS245T Functional Diagram
NOTE: (1 of 8)
P
A
N
B
P
N
OE
DIR
TRUTH TABLE INPUTS OE L L H NOTE: H = High Voltage Level, L = Low Voltage Level, X = Immaterial. DIR L H X OPERATION B Data to A Bus A Data to B Bus Isolation
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ACTS245T Die Characteristics
DIE DIMENSIONS: (2440m x 2970m x 533m 51m) 96 x 117 x 21mils 2mil METALLIZATION: Type: Al Si Cu Thickness: 10.0kA 2kA SUBSTRATE POTENTIAL: Unbiased (Silicon on Sapphire) Bond Pad #20 (VCC) First Bond Pad #20 (VCC) Uses Two Bond Wires Bond Pad #10 (GND) Uses Two Bond Wires BACKSIDE FINISH: Sapphire PASSIVATION: Type: Silox (SiO2) Thickness: 8.0kA 1.0kA WORST CASE CURRENT DENSITY: < 2.0e5 A/cm2 TRANSISTOR COUNT: 420 PROCESS: CMOS SOS
Metallization Mask Layout
ACTS245T
A0 (2) DIR (1) VCC (20) VCC (20) OE (19)
A1 (3)
(18) B0
A2 (4)
(17) B1
A3 (5)
(16) B2
A4 (6)
(15) B3
A5 (7)
(14) B4
A6 (8)
(13) B5
(9) A7
(10) GND
(10) GND
(11) B7
(12) B6
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
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